Pertains to the non-conducting packages that are used to provide larger, more robust assemblies for integrated circuit chips that are then soldered to circuit boards.

Articles in category "Chip carriers"

There are 6 articles in this category.

B

• Ball grid array

D

• Dual in-line package

F

• Flip-chip pin grid array

L

• Low Insertion Force

P

• Pin grid array

U

• UICC